ETFE molding film (Ethylene-Tetrafluoroethylene Copolymer Film) is a high-performance fluorine-based release material specially developed for high-temperature injection molding packaging of semiconductor chips.

ETFE release films are mainly applied to high-temperature packaging processes, including semiconductor EMC epoxy transfer molding, Fan-out packaging

ETFE film is a high-performance material for photovoltaic encapsulation, primarily applied as frontsheet encapsulation film, with prominent advantages in emerging sectors including flexible photovoltaics

All products adopt silicon-free virgin ETFE cast film for Transfer Molding Film-Assisted Molding (FAM/AFT Process) and wafer molding separation. Core pain points resolved