ETFE molding film (Ethylene-Tetrafluoroethylene Copolymer Film) is a high-performance fluorine-based release material specially developed for high-temperature injection molding packaging of semiconductor chips. Its core function is to provide ultra-stable, ultra-clean and residue-free release and support during high-pressure injection of Epoxy Molding Compound (EMC) at 170-180°C. It has become a standard material for advanced packaging including BGA, Fan-out, SiP, Chiplet and automotive-grade chips.
ETFE molding film is a thermoplastic fluoropolymer film produced in Class 100 cleanrooms by melt casting or co-extrusion with high-purity ETFE fluororesin as the base material. It combines the chemical resistance of PTFE with superior processability and mechanical strength.
Temporary Carrier: Holds chips for molding, die attach and other processes to ensure precise positioning Precision Isolation: Forms an isolation layer between chips and molds to prevent adhesion between EMC resin and molds Reliable Release: Its low surface energy enables residue-free peeling and guarantees the cleanliness of chip surfaces
It has a surface energy of only 18-22 dyn/cm with inherent anti-sticking properties, requiring no silicone coating and completely eliminating the risk of silicone migration. No harmful substances such as plasticizers and metal ions precipitate under high temperature and pressure. Its surface cleanliness reaches Class 10 standard, raising the packaging yield from 85% for traditional materials to over 98%. Chip surfaces remain ultra-clean with no residues after peeling, complying with semiconductor Class 100/1000 cleanliness standards.
Long-term service temperature ranges from -200°C to 180°C, with instantaneous temperature resistance up to 300°C, matching the high-temperature injection molding process of EMC. Its thermal shrinkage rate at 180°C is less than 0.1%, far lower than that of PET film (2%) and PI film (0.5%). No creep or wrinkling occurs under high temperature to ensure chip packaging precision. Its glass transition temperature is as low as -65°C, maintaining excellent flexibility even under extreme temperature differences.
It boasts a tensile strength of 65MPa, nearly twice that of PTFE, and an elongation at break of 300-500%, delivering strong tear and bending resistance. It can be reused 500-800 times, 10 times that of PET film and 15 times that of silicone film, greatly reducing the frequency of consumable replacement and downtime costs. It can perfectly fit complex mold surfaces with height differences via vacuum adsorption to avoid wrinkles and voids.
It resists corrosion by strong acids, strong alkalis, organic solvents, EMC resin, flux and other chemicals, with over 5 times higher tolerance than silicone film. It features a symmetric and stable molecular structure without active hydrogen atoms, showing no degradation or precipitation after long-term use to guarantee long-term chip reliability. Its water vapor transmission rate is ≤0.1cm³/(m²·24h·atm), effectively blocking moisture and oxygen from invading electronic devices.
Ultra-thin products ranging from 1 to 50μm are available, with thickness tolerance controlled within ±0.5μm, supporting chip pin density above 1000 contacts per square millimeter. Uniform insulation: The deviation of dielectric strength uniformity is less than 3%, and volume resistivity has no obvious fluctuation across the whole surface, stably withstanding an electric field strength of 150kV/mm. It is compatible with high-density advanced packaging processes such as 3D stacking, Chiplet and Fan-out, precisely filling gaps between chips.
As a thermoplastic material, it can be mass-produced via casting and co-extrusion processes, and ultra-wide films up to 6 meters wide satisfy mass production demands. It can be thermally welded and cut, fitting molding dies of various specifications with strong customization capability. It has good compatibility with metal molds, overcoming PTFE’s disadvantage of poor adhesion to metals.
Thickness: Standard sizes 25μm, 50μm, 75μm, 100μm; customizable range 1-250μm with tolerance ±0.5μm. Ultra-thin specifications for advanced packaging and high-density pins; standard specifications for general packaging. Width: Standard 1250mm; customizable range 1000-1600mm, available in custom slitted and die-cut sheets. Surface Type: Standard glossy release surface; customizable matte vented type, single/double-sided balanced release type, anti-static customized grade. Vented type for complex structural packaging; anti-static type for high-sensitivity chips. Release Force: Standard 10-30g/in; customizable range 8-28g/in with fluctuation error less than ±3g/in. Low release force for ultra-thin chips; high release force for large-size packaging. Color: Transparent or translucent; custom colors such as black for light shielding to meet special packaging demands. Production Environment: Standard Class 100 cleanroom; Class 10 cleanroom for special requirements, applicable to automotive-grade and military chips. Compliance Standards: RoHS, REACH; customizable IATF 16949 for automotive-grade chips and medical electronics.
ETFE Film: Continuous resistance to 180°C, instantaneous resistance to 300°C; thermal shrinkage below 0.1%; no silicone precipitation; reusable for 500-800 cycles; silicone-free inherently. Fully superior and suitable for advanced packaging. PET Film: Heat resistance 70-80°C; thermal shrinkage 2%; possible precipitation; reusable for 50-80 cycles; low precipitation. ETFE doubles heat resistance and extends service life by 10 times. PI Film: Heat resistance 150°C; thermal shrinkage 0.5%; low precipitation; reusable for 100-200 cycles; low precipitation. ETFE has lower thermal shrinkage and better cost performance. Silicone Film: Heat resistance 150°C; thermal shrinkage 0.8%; severe silicone oil precipitation; reusable for 30-50 cycles; extremely high precipitation. ETFE eliminates silicone contamination and extends service life by 15 times. PTFE Film: Continuous heat resistance 200°C; thermal shrinkage 0.2%; no precipitation; reusable for 300-500 cycles; silicone-free. ETFE has higher mechanical strength and better processability. PVDF Film: Heat resistance 150°C; thermal shrinkage 0.6%; low precipitation; reusable for 200-300 cycles; low precipitation. ETFE delivers superior long-term high-temperature stability.
High-end chip packaging: Advanced processes including BGA, Fan-out, SiP, Chiplet and 3D stacking. Automotive-grade chips: IGBT, MOSFET, MCU and other devices complying with AEC-Q100 reliability standards. Scenarios requiring high cleanliness: MEMS, sensors, medical electronics to avoid silicone contamination. Mass production scenarios: Long reusable cycle reduces costs and fits large-scale automated production.
Fan-out Packaging: 12-25μm matte vented type, release force 8-15g/in, anti-static, ultra-thin and high precision. BGA Packaging: 50-75μm glossy standard type, release force 15-25g/in, high dimensional stability. Automotive-Grade IGBT: 75-100μm double-sided balanced release film, release force 20-30g/in, high temperature resistance and mechanical strength. Chiplet/3D Stacking: 1-25μm special coated type, customized release force, ultra-low stress and zero residue.
Shandong Dongyue Future Hydrogen Materials: National Single Champion in Manufacturing with a full industrial chain covering ETFE resin and films. Kabite New Materials (Suzhou): Specializes in ETFE films for semiconductor packaging with precise release force control and Class 100 cleanroom production. Qingdao Ruikeda New Materials: Supplies ETFE films for semiconductor packaging, serves the semiconductor and new energy industries, and provides high-end customized solutions.
Accelerated Localization: Multiple domestic enterprises have achieved independent localization of core technologies including ETFE copolymerization, casting and co-extrusion, breaking import monopolies. Performance Upgrade: Domestic ETFE films achieve a weather-resistant service life of 25-35 years, gradually narrowing the performance gap with international brands. Expanded Application Scope: Applications extend from conventional packaging to high-end fields such as Chiplet and automotive-grade chips. Cost Optimization: Mass production cuts costs with prominent cost-performance advantages.
With six core strengths including intrinsic silicone-free release, ultra-high temperature resistance, ultimate dimensional stability, excellent mechanical properties, strong chemical inertness and ultra-thin high precision, ETFE molding film serves as an ideal release material for chip molding. It is especially applicable to packaging scenarios for high-end chips, automotive-grade chips and scenarios requiring ultra-high cleanliness. With the development of advanced packaging technologies, ETFE molding film will play an increasingly important role in the semiconductor industry.
