ETFE Release Film – Core Advantages & Application Fields

Core Advantages of ETFE Release Film

Silicone-free virgin material, heat resistance of 150–180°C, low extractables, superior toughness compared with PTFE, ultra-low thermal shrinkage, and residue-free peeling. It is mainly applied to epoxy molding, high-temperature hot pressing, and high-cleanliness packaging processes that prohibit silicone contamination.

I. Semiconductor Chip Packaging (Largest & Most Mature Application Segment)

1. EMC Epoxy Molding (No.1 Application)

Applicable packages: QFN, BGA, FC-BGA, SiP, power devices including IGBT & SiC MOSFET, and automotive-grade chip molding. Supporting process: FAM Film-Assisted Molding (SFT Sealing Film / AFT Protective Film)

Functions: Isolate molds from epoxy molding compounds to prevent flash and sticking of molded packages; protect gold wires and electrode areas from resin coverage.

Pain Points Solved: Replaces silicone-coated PET to eliminate electric leakage and bonding failure caused by silicone migration; resistant to cracking under repeated hot pressing and reusable.

2. Fan-Out Wafer Level Packaging (FOWLP)

Used for reconstituted wafer lamination, wafer molding and temporary isolation. Ultra-thin ETFE film matches thin wafers, delivers low peeling stress and reduces risks of wafer chipping and micro-bump damage.

3. Advanced Packaging: 3D Stacking, TSV & HBM

Serves as separation medium for multi-layer chip high-temperature bonding and molding processes. Tolerates segmented high-temperature manufacturing and meets strict cleanliness standards for high-end computing chips.

II. Optoelectronic Device Packaging

1. LED / Mini/Micro LED Packaging

• Epoxy compression molding for high-power LED lenses
• Thermal curing isolation for COB Chip-on-Board packaging
• Temporary carrier separation for mass transfer processes

Advantages: High light transmittance and zero silicone contamination, avoiding impurity pollution of quantum dot materials and chip electrodes.

2. Epoxy Packaging for Camera Modules & Optical Sensors

Release agent for optical surface molding to guarantee lens clarity without haze or residual spot defects.

III. Flexible Electronics & Circuit Packaging

Hot Press Packaging of FPC Flexible Printed Circuits

Isolation for cover film lamination and high-temperature bonding of stiffeners; prevents protective films from adhering to heating plates during lamination and avoids sticking during high-temperature curing of solder mask ink.

IV. New Energy PV Packaging Processes (Release Function, Distinct from ETFE Frontsheet Cover Film)

1. Lamination Packaging of Perovskite Solar Cells

Isolation film for perovskite module lamination: separates laminator platens from cell units to prevent high-temperature adhesion of EVA/POE encapsulant films. ⚠️ Distinction: This is a release & isolation film; the commonly mentioned ETFE frontsheet is an outer protective film for modules and not for release applications.

2. High-Temperature Coating & Curing Carrier for PV POE/EVA Encapsulant Films

V. Composite Material & Special Component Packaging

Isolation for autoclave molding of carbon fiber prepregs and composite compression molding; release liner for thermal conductive adhesive films and structural adhesive high-temperature curing molding.

Simplified Selection Guidelines

Scenarios Where ETFE Release Film Is the Preferred Choice

• Encapsulation materials: EMC epoxy molding compound, epoxy optical adhesive, POE/EVA encapsulant films
• Thermal conditions: Continuous high-temperature hot pressing / molding at 140–180°C
• Mandatory requirements: No silicone contamination, low extractables, delicate precision components (thin wafers, micro-bumps, optical devices)

VI. Domestic Manufacturers of ETFE Release Film

1. Kabete New Materials Technology (Suzhou) Co., Ltd.

Founded in 2021, the company is located in Taicang Economic Development Zone, Suzhou. It operates self-built Class 100,000 dust-free clean production workshops equipped with full imported cast extrusion and plasma surface modification production lines. It is a specialized domestic manufacturer focusing on high-performance functional ETFE release films.

2. Qingdao Ruikeda New Materials Technology Co., Ltd.

A local fluorine film manufacturer based in Qingdao, Shandong Province. It specializes in the semiconductor and photovoltaic markets, with core products including ETFE packaging release films and ETFE PV films compatible with new energy vehicle enterprises and power semiconductor manufacturers. The company provides customized ultra-thin fluorine film slitting and anti-static modification services.