Qingdao Rekeda New Material Technology Co., Ltd., Located in the Shanghe Cooperation Organization Demonstration Zone of Qingdao, Shandong Province, is an innovative technology enterprise focusing on the research and development, production and sales of polymer functional films and special engineering materials.
The company leverages the advantages of Qingdao and the Jiaodong Peninsula's high-end manufacturing and new materials industrial cluster...
Strive to be a global innovation leader in special engineering materials.
Empower industries with professionalism, create value through quality.
An innovative technology enterprise focusing on the R&D, production and sales of polymer functional films and special engineering materials.
Innovation-oriented: Centered on material innovation, we focus on high-end products such as special engineering films, special engineering materials and functional coating materials, and continuously develop innovative products for semiconductors, new energy and biomedicine sectors.
Global-oriented: Rooted in Qingdao and covering the whole world, we rely on the logistics and industrial supporting resources of the Jiaodong Peninsula to deliver rapid response and global services.
应用场景
应用场景
ETFE release films are mainly applied to high-temperature packaging processes, including semiconductor EMC epoxy transfer molding, Fan-out packaging
ETFE film is a high-performance material for photovoltaic encapsulation, primarily applied as frontsheet encapsulation film, with prominent advantages in emerging sectors including flexible photovoltaics
All products adopt silicon-free virgin ETFE cast film for Transfer Molding Film-Assisted Molding (FAM/AFT Process) and wafer molding separation. Core pain points resolved
ETFE molding film (Ethylene-Tetrafluoroethylene Copolymer Film) is a high-performance fluorine-based release material specially developed for high-temperature injection molding packaging of semiconductor chips.
ETFE release films are mainly applied to high-temperature packaging processes, including semiconductor EMC epoxy transfer molding, Fan-out packaging
ETFE film is a high-performance material for photovoltaic encapsulation, primarily applied as frontsheet encapsulation film, with prominent advantages in emerging sectors including flexible photovoltaics
103-2, 1st Floor, Building 4, No.1 Factory Industrial Park, North of Gongye Middle Road and east of Chuangzhi Road, Jiulong Sub-district, Jiaozhou City, Qingdao City, Shandong Province, China
Tel:+86-19863785726 (Mr. Li)
+86-19863785716(Mr. Chong)